Sr. Principal Analog/RF/Mixed Signal IC Design & Development

Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will design and lead development of high speed Transmit (TIA) and Receive (MZMD) components for coherent long-haul and metro systems as well as PAM4 data center systems, primarily using SiGe BiCMOS and CMOS processes.

You will play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers and telecommunications networks, and emerging AI-driven infrastructure.

Responsibilities

• Responsible for design and development of Transmit (TIA) and Receive (MZMD) components for optical network systems (Coherent, PAM4, etc.).
• Innovate and develop new architecture utilizing advanced process nodes, preparing these processes for subsequent product development.
• In charge of many aspects of IC product development, such as design, layout, silicon bring-up and characterization.
• Collaborate with product engineering and optical system groups to evaluate, develop, and refine "white box" specifications into detailed electrical specifications for both Tx and Rx components.
• Provide significant technical contributions to design reviews, verifying design integrity and adherence to standards.
• Work with ASIC group by applying Nokia documentation standards to optimize development cycles.
• Offer technical guidance and share best practices in optical network design and development to mentor new hires and junior team members.

Qualifications

• Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 10 years of related experience in Analog/RF ASIC design and development
• Demonstrated experience in high-speed Analog/RF IC designs (TIA, MZMD) with SiGe BiCMOS technology
• Proven experience in:
• Low noise / high linear (>80GHz) broadband analog circuits for optical front-end
• High-precision analog circuits (e.g., linear regulators, bandgaps, DAC/ADC).
• Deep understanding of detailed transistor-level design, device physics, and control/feedback loop stability analysis
• Knowledge of transmission lines and other high-frequency passive structures
• Strong understanding of package and board-level design optimization
• Experience with RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
• Demonstrated ability to independently resolve complex organizational and technical challenges
• Solid expertise with EDA CAD tools, custom analog layout, 3D EM modeling
• Strong problem-solving and decision-making capabilities
• Highly- self-motivated, detail-oriented, and results-driven
• Must be a team player with good verbal and written communication skills