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Principal Product Engineer - Memory IP
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Where you can work
Locations named
- Nanjing, Jiangsu, China
- Shanghai, Shanghai, China
View location wording from the posting
- Nanjing, China
- SHANGHAI
Employer description
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Primary Responsibilities: ○ Supporting pre-silicon integration, usage, and implementation of memory subsystem products ○ Helping with internal system integration and QA testing of memory subsystem products (Controller + PHY) Analyzing and resolving complex subsystem application or implementation issues and providing professional guidance to customers ○ Supporting various memory PHY and controller SOC integration reviews and implementation reviews ○ Assisting customers with RTL and gate-level simulations to verify functionality ○ Assisting customers with timing closure and other aspects of physical integration Participating in development and refinement of product documentation and checklists for customer applications ○ Supporting post-silicon bringup and production test activities for customers as needed Enhancing customer experience by providing prompt, thorough, and technically accurate responses to customer questions ○ Leveraging AI-powered tools and assistants to enhance productivity, improve decision making, and maintain high-quality customer deliverables. ○Applying AI-powered analytics tools to extract insights, identify patterns, and generate actionable recommendations from complex datasets
Position Requirements: ○ B.S Electrical/Computer Engineering (or similar degree) and 7+ years of overall experience -OR- M.S Electrical/Computer Engineering (or similar degree) and 5+ years of overall experience ○ Experience working with DDR5/4/3, LPDDR5/4/3, HBM3, GDDR6 or similar IPs ○ Verilog RTL design and gate level verification experience ○ Synthesis and static timing analysis experience (physical implementation/verification experience is a plus) ○ Familiarity with industry standard DFT flows and test methodologies. ○ Familiarity with package and board design ○ Ability to read schematics and participate in SI/PI reviews for customer board/package implementation
Preferred Qualifications
○ Experience with Memory PHY and DSP based architecture ○ Experience with embedded microcontroller FW ○ Background with scripting and applying AI solutions to daily workflows
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